Chip_Tray＆Waffle_Pack

Product Details

The Chip Tray & Waffle Pack series from Hiner-pack are provided a safe and convenient way of packaging and transportation for Chip,Die , COG,Optoelectronic devices and other microelectronic components. Products with multiple sizes and different materials are available, product specifications have 2 inches,3 inches and 4 inches.Materials have Antistatic / Conductive ABS and PC. can also be customized according to customer's special requirements.

We have avariety of sizes and styles of Chip Tray &Waffle Pack mold, Chip Tray & Waffle Pack high requirements for product size and flatness,Hiner- pack from the product mold design that is imported Moldflow analysis ,then can accurately control the product size precision and plane degree in accordance with the control of material characteristics, mold structure and injection molding conditions,so as to meet the quality requirements of customers.

Permanent Antistatic,according ESD and RoHS environmental standards.

Cooperate with automation to improve product yield and production efficiency.

Stable size,high precision can make the product transportation without crushed.

Dust-free cleaning packaging after product forming, suitable for class10- 1000 cleanroom.

Design style and size according to customer's special requirements.